Honda Motor and IBM are planning a long-term collaboration on research and development for advanced semiconductor processes, such as brain-like computing and technologies for lower-cost, high-performing chiplets, to support the production of software-defined vehicles.
The companies outlined their plan in a memorandum of understanding that they jointly announced on Tuesday. According to the announcement, the rapid acceleration and extensive use of artificial intelligence anticipated onward from 2030 will create new opportunities for SDV development.
In their MOU, Honda and IBM pointed out that SDV development faces future challenges, including increased complexity in the design, processing capability and power utilization of the vehicle’s semiconductors. The companies said such challenges can be addressed through independent R&D in next-generation computing processes, including studies on open and flexible software solutions.
The MOU’s announcement follows Honda’s disclosure Friday that it plans to increase R&D spending for the year, up by a quarter of what it spent for fiscal year 2024. Honda President Toshihiro Mibe said electric vehicles are among the spending priorities.
In March 2023, Honda announced a basic agreement on a software development partnership with Indian multinational KPIT Technologies. The focus areas of the partnership include operating systems development for next-generation electrical/electronic architecture.