Intel said it has delivered the first multi-chip package prototypes under the State-of-the-Art Heterogeneous Integrated Packaging program six quarters ahead of schedule. The company, which was awarded a contract by the Department of Defense in 2020 under the program, aims to create state-of-the-art microelectronics packaging solutions to support DOD’s mission to strengthen the United States’ role in the microelectronics ecosystem. The prototypes were delivered in close partnership with BAE and the U.S. government. Intel’s MCP capabilities offer up to 10 times the size, weight and power advantage compared to other products in the market. The delivery of the MCP prototypes marks a significant milestone in securing access to cutting-edge microelectronics packaging and advancing DOD’s modernization efforts. It also supports the diversification of the defense supply chain, protection of intellectual property and preservation of critical capabilities within the U.S. The SHIP program will continue to develop prototypes and drive advancements in chiplet size, weight, power, performance and interface standards, protocols and security for heterogeneous systems.